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  2. Group Structure

    • ASM Pacific Technology
        • Wire bonders
        • Die bonders
        • Encapsulation solutions
        • Test handlers
        • Clip bonders,
        • CIS ?equipment
        • TCB bonders
        • Flip chip bonders
        • Mold Under Fill (MUF)
        • Panel molding
        • Laser grooving and dicing
        • Leadframes
        • Advanced packaging materials (molded interconnect substrates)
        • Assembly line solutions
        • DEK printing systems
        • SIPLACE placement systems
        • ASM smart factory tools & services
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